PCBfabrication.com Technical Specifications
PCB Fabrication Capabilities
The following table summarizes our standard PCB manufacturing envelopes and test parameters.
For tighter tolerances, HDI, or custom stackups, please contact us.
Check the specs first, then quote with confidence
This page helps you confirm board thickness, copper weight, hole size, impedance control limits, surface finish, and electrical test capability before submitting your order.
| Structure & Dimensions | Technology index | ||
| Layer counts | 0–20L | ||
|---|---|---|---|
| CEM FR4; High Tg FR4; PTFE; Aluminum base; Rogers | |||
| Board thickness | 0.01inch/0.20mm–0.24inch/6.0mm | ||
| Board thickness tolerance | ±10% | ||
| Maximum board size | 20.08inch/510mm × 47.01inch/1194mm | ||
| Board outline tolerance | ±3.94mil (±0.10mm) | ||
| Drilling hole size (Mechanical) | 7.87mil/0.20mm | ||
| Finished hole size (Mechanical) | 3.94mil/0.10mm | ||
| Registration (Mechanical) | ±0.075mm (2.95mil) | ||
| Aspect Ratio | 10:1 | ||
| Copper & Process Capability | |||
| Multi-Layer PCB External Copper Thickness | 0.5oz/18μm–4oz/140μm | ||
| 1 & 2 layer PCB External Copper Thickness | 0.5oz/18μm–9oz/315μm | ||
| Internal layer copper thickness | 0.5oz/18μm–4oz/140μm | ||
| PTH wall copper thickness | 0.5-1.4mil / 12–35μm | ||
| Minimum impedance control line width | 4.5mil/0.11mm | ||
| Dielectric thickness between layers | 2.95-196.85mil / 0.075–5.0mm | ||
| Solder mask type | LPI | ||
| Minimum solder mask dam | 3.94mil / 0.10mm | ||
| Minimum solder mask clearance | 1.97mil / 0.05mm | ||
| Maximum plug hole size | 23.62mil / 0.60mm Max | ||
| Designed Conductor Width / Space (Minimum) | 4.0mil/0.10mm | ||
| Impedance Tolerance of Finished Board (Minimum) | ±10% | ||
| Surface Finish Options | |||
| Surface finish | HASL (thickness) | 1–25μm/2–50μm | |
| Lead Free HASL (thickness) | 1–25μm/2–50μm | ||
| Electroless Nickel Immersion Gold (thickness) | >0.002mil (>0.05μm) | ||
| Immersion Silver (thickness) | 0.006–0.03mil/0.15–0.75μm | ||
| Immersion Tin (thickness) | >0.04mil (>1.0μm) | ||
| OSP (thickness) | 0.008–0.02mil/0.2–0.5μm | ||
| Flash gold (thickness) | >0.02mil (>0.05μm) | ||
| Peelable solder mask (thickness) | 0.30mm min | ||
| Gold fingers (thickness) | 3u"–30u" | ||
| Electrical Testing Capability | |||
| Bare board test | E-Test | Maximum testing points | 64,512 points (both sides) |
| Maximum testing board size | 16.97inch/431mm × 37.20inch/945mm | ||
| Minimum testing pad size | 7.87mil / 0.20mm | ||
| Minimum testing pad pitch | 11.81mil / 0.30mm | ||
| Maximum testing voltage | 300V | ||
| Maximum testing insulating resistance | 100MΩ | ||
| Minimum testing continuity resistance | 5MΩ | ||
| Flying Probe | Maximum testing points | No restriction | |
| Maximum testing board size | 15.94inch/405mm × 24.02inch/610mm | ||
| Minimum testing pad size | 5.91mil / 0.15mm | ||
| Minimum testing pad pitch | 11.81mil / 0.30mm | ||
Not sure which specification applies to your PCB?
If you are unsure about thickness, copper weight, impedance control, or whether your design needs tighter tolerances, start with our FAQ pages or contact us before placing the order.
Ready to get a PCB quote?
After checking the fabrication limits above, use our online quotation system to submit your board parameters and get pricing quickly.
Related pages: What Is PCB Fabrication? | PCB Tolerance Standards | Controlled Impedance PCB | PCB Quote Online Guide