Shengyi PCB Material Guide
This page introduces key PCB material categories from Shengyi Technology Co., Ltd. for automotive, high speed digital, halogen-free FR-4, lead-free FR-4, and RF / microwave PCB applications. The page is built as an HTML-first guide for better customer understanding and better search visibility, while official PDF Technical Datasheet files can be added later as download references for each material model.
PCB Material Selection Guide
Material selection should be based on actual engineering requirements rather than on a file list alone. In practical PCB design, the key decision drivers usually include reliability, thermal performance, signal integrity, loss, frequency range, halogen-free requirement, and the target application such as automotive, server, medical, communications, or RF / microwave.
| Main Goal | Choose the simplest material that can reliably meet electrical, thermal, mechanical and compliance requirements. |
|---|---|
| Standard FR-4 Use | Suitable for many general commercial and industrial PCB applications. |
| High Speed Use | Needed when insertion loss, dielectric performance and signal quality become more critical. |
| RF / Microwave Use | Needed for higher frequency and lower loss requirements that go beyond ordinary FR-4 capability. |
| Automotive Use | Usually emphasizes higher reliability, thermal endurance, CTI, lead-free compatibility and long-term stability. |
Page Map
1. Automotive PCB Material
This category is oriented toward automotive-use laminate and prepreg solutions where long-term reliability, lead-free compatibility, thermal robustness, moisture resistance, and application stability are more important. The AUTOLAD family covers multiple automotive PCB material tiers from standard reliability-focused designs to HDI, high-CTI, and higher-temperature power applications.
AUTOLAD 1
Material Focus:
- Environmental reliability
- Thermal cycling stability
- Moisture resistance
AUTOLAD 1 is an automotive-grade FR-4 laminate designed for applications requiring strong thermal stability, moisture resistance, and long-term reliability under harsh environmental conditions. It is suitable for automotive electronics and industrial environments where reliability is more critical than high-speed signal performance.
Key Features:
- Automotive-grade reliability
- Good thermal performance (Tg 160°C)
- High thermal conductivity (0.74 W/m·K)
- Excellent moisture resistance performance
- Stable electrical properties under humidity conditions
- Compatible with standard FR-4 PCB processes
Key Properties:
- Tg: 160°C
- Td: 348°C
- Z-axis CTE: 37 ppm/°C (before Tg), 230 ppm/°C (after Tg)
- T260: 60 minutes
- T288: 20 minutes
- Dk: 4.6 @ 1GHz
- Df: 0.011 @ 1GHz
- Thermal Conductivity: 0.74 W/m·K
- Water Absorption: 0.09%
- Dielectric Breakdown: 45+ kV
- Flammability: UL 94 V-0
Typical Applications:
- Automotive control systems
- Body electronics
- Industrial control electronics
- Harsh environment electronics
- General multilayer automotive PCBs
AUTOLAD 1G
AUTOLAD 1G is a halogen-free automotive PCB material intended for HDI and multilayer applications requiring improved thermal stability, CAF resistance, and environmental compliance.
Key Features:
- Halogen-free and antimony-free system
- Improved Tg up to 173°C
- High Td up to 400°C
- Excellent CAF resistance
- Low Z-axis CTE for HDI and multilayer reliability
- Suitable for advanced automotive electronic modules
Key Properties:
- Tg: 173°C
- Td: 400°C
- Z-axis CTE: 35 / 189 ppm/°C
- T288: 60 minutes
- Dk: 4.05 @ 10GHz
- Df: 0.012 @ 10GHz
- Water Absorption: 0.09%
- Flammability: UL 94 V-0
Typical Applications:
- Automotive electronics
- Camera modules
- Domain controllers (MDC)
- HDI multilayer PCBs
- Harsh environment electronics
AUTOLAD 2G
AUTOLAD 2G is an advanced automotive-grade FR-4 material designed for high reliability, high CTI performance, and harsher electrical and thermal operating environments.
Key Features:
- Automotive-grade reliability and environmental durability
- High Tg up to 190°C
- Excellent CAF resistance
- Low Z-axis CTE for multilayer stability
- High CTI (PLC 0) for insulation reliability
- Compatible with standard FR-4 PCB processes
Key Properties:
- Tg: 190°C
- Td: 402°C
- T260: 60 min
- T288: 45 min
- Dk: 4.5 @ 1GHz
- Df: 0.012 @ 1GHz
- CTI: PLC 0
- Water Absorption: 0.09%
- Flammability: UL 94 V-0
Typical Applications:
- Automotive control systems
- Power electronics
- High-reliability industrial electronics
- Harsh environment electronics
- HDI and multilayer PCBs
AUTOLAD 3
Performance Tier:
- AUTOLAD 1 → Standard Automotive
- AUTOLAD 1G → HDI Automotive
- AUTOLAD 2G → High Reliability / High CTI
- AUTOLAD 3 → Power / Thermal Applications
AUTOLAD 3 is a high-temperature automotive-grade FR-4 material designed for power electronics and applications requiring strong thermal stability and resistance to extreme soldering and thermal stress conditions.
Key Features:
- High Tg up to 185°C
- Supports high temperature exposure up to 300°C (T300)
- Good thermal conductivity (0.62 W/m·K)
- Excellent solder heat resistance
- Stable performance under thermal cycling
- Suitable for power and high-current applications
Key Properties:
- Tg: 180–185°C
- Td: 355°C
- T260: 60 min
- T288: 30 min
- T300: 15 min
- Dk: 4.9
- Df: 0.018
- Thermal Conductivity: 0.62 W/m·K
- Water Absorption: 0.08%
- Flammability: UL 94 V-0
Typical Applications:
- Automotive power electronics
- Power control modules
- High current circuits
- Charging systems
- Thermal stress critical environments
2. Lead-Free Compatible FR-4
Lead-free compatible FR-4 materials from Shengyi Technology Co., Ltd. are widely used in standard to advanced multilayer PCB applications. These materials offer strong thermal reliability, stable dielectric performance, and are suitable for servers, communications, automotive, medical, and high layer count PCB designs.
S1000-2
S1000-2 is a lead-free compatible FR-4 laminate and prepreg material with high heat resistance, low Z-axis CTE, and excellent through-hole reliability. It is suitable for high layer count PCB and server-grade applications.
Key Properties:
- Tg (DSC): 180°C
- Tg (DMA): 185°C
- Td: 345°C
- Dk @1MHz: 4.80
- Df @1MHz: 0.013
- Water Absorption: 0.10%
- Flammability: UL 94 V-0
Typical Applications:
- Servers
- Storage Area Networks (SANs)
- Switches & Routers
- High Layer Count PCBs
- Computers
- Medical
- Test
S1000-2M
S1000-2M is a high Tg, high performance FR-4 material with low Z-axis CTE, designed for high reliability applications such as automotive electronics, communications systems, and high multilayer PCB designs.
Key Properties:
- Tg (DMA): 185°C
- Tg (DSC): 180°C
- Td: 355°C
- Dk @1GHz: 4.6
- Df @1GHz: 0.018
- CTE (Z-axis): 41 / 208 ppm/°C
- Water Absorption: 0.08%
- Flammability: UL 94 V-0
Key Features:
- Anti-CAF capability
- Lead-free compatible
- Excellent thermal reliability
- Excellent through-hole reliability
- Excellent mechanical process ability
Typical Applications:
- Computer
- Communication
- Automotive electronics
- High multilayer PCB
S1190
S1190 is a lead-free compatible high Tg FR-4 laminate and prepreg material from Shengyi Technology. It offers strong thermal reliability, stable dielectric performance, and good suitability for multilayer PCB applications that require higher thermal endurance and dependable electrical properties.
Key Properties:
- Tg (DMA): 200°C
- Tg (DSC): 190°C
- Td: 350°C
- Z-axis CTE: 45 ppm/°C (before Tg), 210 ppm/°C (after Tg)
- T260: 60 minutes
- T288: 45 minutes
- Dk: 4.6 @ 1GHz; 4.8 @ 1MHz
- Df: 0.015 @ 1GHz; 0.009 @ 1MHz
- Thermal Conductivity: 0.53 W/m·K
- Water Absorption: 0.12%
- Flammability: UL 94 V-0
Material Highlights:
- High Tg FR-4 platform for lead-free process compatibility
- Good thermal stability for multilayer PCB fabrication
- Controlled dielectric behavior for general to advanced electronic applications
- Suitable where stronger thermal margin is preferred over standard FR-4
3. Halogen-Free & High CTI FR-4
This category covers halogen-free FR-4 materials designed for applications requiring stronger electrical insulation reliability, high Comparative Tracking Index (CTI), and environmental compliance. These materials are suitable for products where safety performance, anti-tracking capability, and lead-free processing compatibility are important.
S1151G
S1151G is a halogen-free FR-4 laminate with high Comparative Tracking Index (CTI ≥ 600V), designed for applications requiring enhanced electrical insulation reliability and environmental compliance. It is suitable for communications equipment, mobile phones, computers, instrumentation, TV, VCR, and electronic game machine applications.
Key Features:
- Halogen-Free & High CTI material
- Lead-Free compatible
- Constituents free of halogen and red phosphorus
- UV Blocking / AOI compatible
- High CTI, CTI ≥ 600V
Key Properties:
- Tg (DSC): 150°C
- Td: 360°C
- Z-axis CTE: 36 ppm/°C (before Tg), 220 ppm/°C (after Tg)
- Z-axis expansion (50–260°C): 2.8%
- T260: 60 minutes
- T288: 15 minutes
- Dk: 4.5 @ 1MHz
- Df: 0.010 @ 1MHz
- Dielectric Breakdown: 45+ kV
- CTI: PLC 0 (≥600V)
- Arc Resistance: 140 seconds
- Water Absorption: 0.10%
- Flammability: UL 94 V-0
Typical Applications:
- Communications equipment
- Mobile phone
- Computer
- Instrumentation
- TV / VCR
- Electronic game machine
4. Low Loss / High Speed FR-4
This category covers advanced FR-4 materials developed for high-speed digital, communication, server, telecom, and networking applications where lower insertion loss, higher thermal stability, better plated-through-hole reliability, and stronger multilayer performance are required.
Selection Guide:
- S1150G: balanced FR-4 with improved dielectric performance and thermal conductivity
- S7040G / S7040GB: optimized for lower loss and higher-speed signal transmission
- S7045G / S7045GB: optimized for high Tg, stable dielectric behavior, and multilayer structural reliability
S1150G
S1150G is a lead-free compatible FR-4 laminate designed to provide a balance of thermal stability, improved dielectric performance, and enhanced heat dissipation. It is suitable for multilayer PCB applications where moderate Tg, lower signal loss, and better thermal conductivity are required.
Key Properties:
- Tg (DMA): 160°C
- Tg (DSC): 155°C
- Td: 355°C
- Z-axis CTE: 40 ppm/°C (before Tg), 230 ppm/°C (after Tg)
- T260: 60 minutes
- T288: 45 minutes
- Dk: 4.6 @ 1GHz; 4.9 @ 1MHz
- Df: 0.011 @ 1GHz; 0.009 @ 1MHz
- Thermal Conductivity: 0.77 W/m·K
- Water Absorption: 0.1%
- Peel Strength: 1.5 N/mm
- Flammability: UL 94 V-0
Material Highlights:
- Lower loss FR-4 suitable for higher frequency applications
- Improved thermal conductivity for better heat dissipation
- Good balance between cost and performance
- Suitable for multilayer PCB designs requiring stable electrical behavior
S7040G / S7040GB
S7040G (laminate) and S7040GB (prepreg) are advanced halogen-free FR-4 materials designed for high-speed and high-reliability multilayer PCB applications. They provide high Tg, lower insertion loss, low Z-axis CTE for improved plated-through-hole reliability, and excellent anti-CAF performance. These materials are well suited for server, switch, router, base station, backplane, and line card designs.
Key Features:
- High Tg > 170°C (DSC)
- Lower insertion loss
- Dk / Df: 3.9 / 0.0075 @ 1GHz
- Lower Z-axis CTE for superior PTH reliability
- Excellent anti-CAF performance
- Halogen-free and compatible with lead-free process
Key Properties:
- Tg (DMA): 185°C
- Tg (DSC): 175°C
- Td: 405°C
- Z-axis CTE: 36 ppm/°C (before Tg), 218 ppm/°C (after Tg)
- Z-axis expansion (50–260°C): 2.0%
- T260: 60 minutes
- T288: 60 minutes
- Dk: 3.90 @ 1GHz; 4.05 @ 10GHz
- Df: 0.0075 @ 1GHz; 0.0105 @ 10GHz
- Dielectric Breakdown: 45+ kV
- Water Absorption: 0.12%
- Peel Strength: 1.2 N/mm @ 288°C/10s; 1.0 N/mm @ 125°C
- Flammability: V-0
Typical Applications:
- Server
- Switch
- Router
- Base station
- Backplane
- Line cards
S7045G / S7045GB
S7045G (laminate) and S7045GB (prepreg) are high Tg halogen-free FR-4 materials designed for high-performance computing, server, telecom, and multilayer PCB applications. Compared to lower-loss materials, S7045G provides enhanced thermal stability, improved structural reliability, and consistent electrical performance for demanding PCB designs.
Key Features:
- High Tg halogen-free FR-4 material
- Stable dielectric performance across frequency range
- Lower Z-axis CTE for improved PTH reliability
- Lead-free compatible processing
- Designed for server, telecom, backplane, and high performance computing applications
Key Properties:
- Tg (DMA): 180°C
- Td: 390°C
- Z-axis CTE: 45 ppm/°C (before Tg), 210 ppm/°C (after Tg)
- Z-axis expansion (50–260°C): 2.3%
- T260: 60 minutes
- T288: 60 minutes
- Dk: 4.4 @ 1GHz; 4.5 @ 3GHz / 5GHz
- Df: 0.010 @ 1GHz; 0.014 @ 3GHz; 0.015 @ 5GHz
- Dielectric Breakdown: 45+ kV
- Water Absorption: 0.12%
- Peel Strength: 1.0 N/mm
- Flammability: V-0
Typical Applications:
- Servers
- Telecom systems
- Base stations
- Backplanes
- Line cards
- High performance computing
S7439
S7439 is a high-performance FR-4 laminate and prepreg system developed for high-speed digital, multilayer PCB applications requiring strong electrical performance, high thermal stability, and excellent long-term reliability. It is well suited for advanced server, switching, routing, backplane, line card, HDI, and hybrid PCB builds.
Key Features:
- High speed low loss FR-4 system
- High Tg: 200°C (DSC)
- Low CTE: 45 / 210 ppm/°C
- High Td: 385°C
- Dk / Df: 3.80 / 0.0068 @ 10 GHz
- Stable Dk/Df over frequency and temperature
- Superior CAF performance
- Supports HDI, hybrid, and high layer count builds
- Standard FR-4 PCB processes
Key Properties:
- Tg (DMA): 205°C
- Tg (DSC): 200°C
- Td: 385°C
- Z-axis CTE: 45 ppm/°C (before Tg), 210 ppm/°C (after Tg)
- T288: 120 minutes
- T300: 60 minutes
- Dk: 3.85 @ 1GHz; 3.80 @ 10GHz
- Df: 0.0045 @ 1GHz; 0.0068 @ 10GHz
- Thermal Conductivity: 0.60 W/m·K
- Water Absorption: 0.09%
- Electrical Strength: 34.7 kV/mm
- Flammability: UL 94 V-0
Typical Applications:
- High speed servers
- High speed SANs
- Switches and routers
- High layer count backplanes
- High layer count line cards
- Burn-in boards
- HDI builds
- Hybrid builds
- Military and aerospace electronics
S7439G
S7439G is a high-performance low-loss FR-4 laminate developed for high-speed digital, server, telecom, switch, router, and multilayer PCB applications requiring stable electrical performance, strong thermal reliability, and balanced manufacturability. Compared with S7439, S7439G is positioned as a 180°C Tg version with a more balanced cost-performance profile for stable mass production.
Key Features:
- High speed low loss FR-4 system
- High Tg: 180°C
- Low Dk / Df performance for high-speed digital designs
- Stable dielectric properties over frequency and temperature
- Low Z-axis CTE for multilayer reliability
- High Td and good thermal endurance
- Excellent CAF resistance
- Suitable for HDI, hybrid, and high layer count PCBs
- Compatible with standard FR-4 PCB processing
Key Properties:
- Tg: 180°C
- Td: 404°C
- Z-axis CTE: 45 ppm/°C (before Tg), 210 ppm/°C (after Tg)
- Dk: 3.9 @ 10GHz
- Df: 0.0070 @ 10GHz
- Low moisture absorption
- High reliability multilayer performance
- Flammability: UL 94 V-0
Typical Applications:
- High speed servers
- Switches and routers
- Telecom systems
- Backplanes and line cards
- HDI and hybrid builds
- High layer count communication PCBs
5. Ultra Low Loss / Ultra High Speed Materials
This category includes advanced non-standard FR-4-class high-performance materials engineered for ultra high-speed digital applications requiring extremely low signal loss, superior thermal performance, and high multilayer reliability.
Synamic 6
Synamic 6 is a proprietary high-performance PPE-based laminate and prepreg system designed for ultra high-speed digital applications. It delivers extremely low loss, stable dielectric behavior across frequency and temperature, and superior thermal and reliability performance.
Key Features:
- Ultra low loss: Dk 3.50 / Df 0.0046 @ 10 GHz
- Stable dielectric performance over wide frequency and temperature range
- High Tg: 210°C
- Low CTE for high reliability multilayer designs
- Excellent CAF resistance
- Supports HDI and hybrid PCB builds
- Compatible with standard FR-4 PCB processes
Key Properties:
- Tg (DMA): 210°C
- Tg (DSC): 210°C
- Td: 405°C
- Z-axis CTE: 45 ppm/°C (before Tg), 180 ppm/°C (after Tg)
- T288: >120 minutes
- T300: >60 minutes
- Dk: 3.64 @ 1GHz; 3.50 @ 10GHz
- Df: 0.0021 @ 1GHz; 0.0046 @ 10GHz
- Thermal Conductivity: 0.65 W/m·K
- Water Absorption: 0.09%
- Flammability: UL 94 V-0
Typical Applications:
- High-speed servers (25 Gbps+)
- High-speed SAN systems
- Switches and routers
- Backplanes and line cards
- HDI and hybrid designs
- Military and aerospace electronics
SYNAMIC 6N
Synamic 6N is the low Dk glass version of the same resin system family. Detailed official datasheet values can be added after the corresponding PDF is provided.
6. RF and Microwave PCB Material
RF and microwave PCB applications generally require lower loss behavior, more stable dielectric control, and material systems that match the actual operating frequency range. This section has been structurally organized into 8 RF material entries and practical performance tiers so customers can compare ultra low loss PTFE, mmWave-grade, and cost / performance balanced options more efficiently.
| Tier | Main Direction | Recommended Material Models |
|---|---|---|
| Tier 1 | Ultra low loss, premium RF / radar / phased array / satellite designs | SCGA-500 GF220, mmWave77 |
| Tier 2 | Low loss PTFE materials for strong RF performance with broader manufacturability | SCGA-500 GF255, SCGA-500 GF265 |
| Tier 3 | Balanced RF / microwave materials for communication, antenna and volume production use | mmWAVE, SCGA-500 GF300, AEROWAVE 300, S7136H |
Tier 1: Ultra Low Loss
Best fit when insertion loss, PIM, and dielectric stability are primary selection drivers.
Tier 2: Strong RF Balance
Suitable when you still need low loss PTFE performance but want broader design flexibility and cost balance.
Tier 3: Value and Manufacturability
Suitable when RF performance is important, but standard process compatibility, cost control, or production scale also matter.
SCGA-500 GF220
Ultra low loss PTFE woven glass materials.
mmWave77
High frequency low loss materials.
SCGA-500 GF255
Low loss PTFE woven glass materials.
SCGA-500 GF265
Low loss PTFE woven glass materials.
mmWAVE
Ultra low loss woven glass PPE material.
SCGA-500 GF300
Low loss PTFE woven glass materials.
S7136H
High-frequency low loss materials.
AEROWAVE 300
High frequency low loss materials.
Technical Datasheet Download Zone
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