Via-In-Pad PCB Technology
Copper-filled microvia inside the pad for fine-pitch BGA escape, lowest inductance return path, and superior SI/PI.
HDI • Planarization • ENIG/ENEPIG • 0.3 mm BGA • SI/PI
What is Via-In-Pad?
Via-in-pad places a microvia directly under the component pad, enabling:
- 0.30–0.40 mm BGA escape
- Shortest inductive return path
- Cleaner high-speed routing
- Compact HDI layout
Via-In-Pad Structure
Laser drilled → copper filled → planarized → copper cap → ENIG/ENEPIG
When to Use Via-In-Pad
- 0.30–0.40 mm BGA CPU/FPGA
- PCIe Gen4/Gen5 / DDR4/DDR5
- 112G PAM4 / SerDes
- RF SiP / PA / LNA
- Wearables / compact HDI
HDI Design Rules (Via-In-Pad)
| Parameter | Recommended | Notes |
|---|---|---|
| Microvia drill | 0.10–0.15 mm | Laser via |
| Aspect ratio | ≤1:1 | Reliable plating |
| Fill | Copper fill | For BGA pad-on-via |
| Planarity | ±5 μm | Critical for BGA solder |
| Finish | ENIG / ENEPIG | Best wettability |
Sample Boards
Assembly & DFM Notes
- Use ENIG / ENEPIG
- Flat cap avoids BGA voids
- No extra paste on filled via
- Specify “copper-filled + planarized”
Send Your BGA Design for HDI Review
We verify fill quality, planarity, SI/PI, and assembly readiness.