Rogers High-Frequency PCB Fabrication

Microwave, RF, antenna and high-speed digital laminates for communication, radar and sensing systems.

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IPC-6012 / RF laminate traceability / Dk & Df verification / Controlled impedance

We fabricate RF & microwave PCBs using genuine Rogers™ laminates, supporting phased array radar, 5G/mmWave, satellite communication, and controlled-impedance digital systems. For broader laminate options, review our PCB material guide.

For stack-up planning and manufacturing limits, please also review our PCB manufacturing capability page. If your design files are ready, you can go directly to our PCB quote page.

Email RF stack-up for engineering review: [email protected]

Design data check before submission: PCB File Checklist | PCB File Review

Rogers RF & Microwave PCB Applications

Radar & Phased-Array

Beam-forming arrays, RF front-ends, mmWave boards

Satellite & Space RF

Ka/Ku-band RF FE, downlink PA/LNA, space-grade RF

5G / mmWave

mmWave modules, RF SiP, phased-array designs

High-Speed Digital

SERDES / PCIe Gen4/5, differential pairs. For mixed-signal build ranges, see capability details.

RF Power

High-power PA, low-loss matching networks

Defense & Secure RF

Secure RF links, mission-critical comm boards

Engineering Capability Snapshot

Up to 16-layer RF/digital hybrid stack-ups
0.5–3 oz copper, ENIG / ENEPIG / Imm Ag
±8% impedance control typical
Material verification & micro-section on request

Preferred data format: ODB++ / IPC-2581 for impedance-critical RF routing.

Related engineering pages: PCB Capability | PCB Quote Online | Contact PCB Engineer

Rogers Laminates We Support

Material	εr	Loss (tanδ)	Thickness	Applications
RO4350B	3.48	0.0037	0.254–2.36mm	RF microwave
RO4003C	3.55	0.0027	0.203–2.36mm	Mixed RF & digital
RO3003	3.00	0.0010	0.13–1.52mm	Precision RF front-end
RT/duroid® 5880	2.20	0.0009	0.127–3.18mm	Microwave / radar