Hot Air Solder Level [HASL]
Pros: Excellent solderability after long term storage, Excellent bond strength – like product throughout the loading process Cons: Prone to slight doming of surface mount pads, Not suitable for contact pads or edge connectors
Shelf Life: Minimum 12+ months with optimal storage and handling
ImmersionSiln Sliver [0.05um Ag] Pros: Excellent solderability and bond strength, Perfectly flat pads, Suitable for contact pads in controlled climates/conditions
Cons: Finish easily tarnished with inappropriate handling or storage, Not suitable for edge connectors or contact pads in aggressive climates/conditions
Shelf Life: Minimum 6 months with optimal storage and handling
Immersion Gold [0.03um Au]
Pros: Excellent solderability and bond strength, More resistant to air contamination than Immersion Silver
Cons: Will lose 'gold lustre' over time as the copper migrates into the gold, Not suitable for contact pads or edge connectors
Shelf Life: Minimum 6 months with optimal storage and handling
Immersion Gold over Immersion Silver [0.03um Au/0.05umAg] Pros: Excellent solderability and bond strength, Perfectly flat pads, Resistant to air contamination, Suitable for contact pads in controlled climates/conditions
Cons: Not suitable for edge connectors or contact pads in aggressive climates/conditions
Shelf Life: Minimum 12 months with optimal storage and handling
Electroplated Gold over Immersion Silver [0.2um Hard Au/0.05um Ag] Pros: Excellent solderability, Perfectly flat pads, Very resistant to air contamination, Suitable for contact pads, zebra strips and edge connectors where a low number of contact cycles are required
Cons: Not suitable for edge connectors where a high number of contact cycles are required.
Shelf Life: Minimum 12+ months with optimal storage and handling
Hot Air Solder Level [HASL]
